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 MC74HC595A 8-Bit Serial-Input/Serial or Parallel-Output Shift Register with Latched 3-State Outputs
High-Performance Silicon-Gate CMOS
The MC74HC595A consists of an 8-bit shift register and an 8-bit D-type latch with three-state parallel outputs. The shift register accepts serial data and provides a serial output. The shift register also provides parallel data to the 8-bit latch. The shift register and latch have independent clock inputs. This device also has an asynchronous reset for the shift register. The HC595A directly interfaces with the SPI serial data port on CMOS MPUs and MCUs.
Features http://onsemi.com MARKING DIAGRAMS
16 16 1 PDIP-16 N SUFFIX CASE 648 1 16 MC74HC595AN AWLYYWW
* * * * * * * *
*
Output Drive Capability: 15 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A Chip Complexity: 328 FETs or 82 Equivalent Gates Improvements over HC595 - Improved Propagation Delays - 50% Lower Quiescent Power - Improved Input Noise and Latchup Immunity Pb-Free Packages are Available*
16 1
SOIC-16 D SUFFIX CASE 751B 1
HC595A AWLYWW
16 16 1 TSSOP-16 DT SUFFIX CASE 948F 1 HC 595A ALYW
A L, WL Y, YY W, WW
= = = =
Assembly Location Wafer Lot Year Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2005
1
April, 2005 - Rev. 9
Publication Order Number: MC74HC595A/D
MC74HC595A
LOGIC DIAGRAM
SERIAL DATA INPUT A 14 15 1 2 3 SHIFT REGISTER 4 LATCH 5 6 7 SHIFT 11 CLOCK 10 RESET LATCH 12 CLOCK OUTPUT 13 ENABLE QA QB QC QD QE QF QG QH PARALLEL DATA OUTPUTS
PIN ASSIGNMENT
QB QC QD QE QF QG QH GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC QA A OUTPUT ENABLE LATCH CLOCK SHIFT CLOCK RESET SQH
9
SQH
SERIAL DATA OUTPUT
VCC = PIN 16 GND = PIN 8
ORDERING INFORMATION
Device MC74HC595AN MC74HC595ANG MC74HC595AD MC74HC595ADG MC74HC595ADR2 MC74HC595ADR2G MC74HC595ADT MC74HC595ADTR2 MC74HC595AFEL MC74HC595AFELG Package PDIP-16 PDIP-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) SOIC-16 SOIC-16 (Pb-Free) TSSOP-16* TSSOP-16* SOEIAJ-16 SOEIAJ-16 (Pb-Free) Shipping 500 Units / Rail 500 Units / Rail 48 Units / Rail 48 Units / Rail 2500 Tape & Reel 2500 Tape & Reel 96 Units / Rail 2500 Tape & Reel 2000 Tape & Reel 2000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb-Free.
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MC74HC595A
II I I I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I II I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II I I II I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II I I I I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I II IIIIIIIIIIII I IIIIIIIIIIIIII I I I II I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIII II I I I IIIIIIIIIIIIIIIIIIIIIII I II I II II I I IIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIII I II II IIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIII I II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII II I
IIIIIIIIIIIIIIIIIIII II I IIII II I I IIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIII II I II II I I I IIIIIIIIIIIIIIIIIIIIIII I II IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII II I I III II IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII II III II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS
Symbol VCC Vin Parameter Value Unit V V V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 35 75 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic DIP SOIC Package TSSOP Package mW Tstg TL Storage Temperature - 65 to + 150 260 _C _C Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package)
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND)
Min 2.0 0
Max 6.0
Unit V V
Vin, Vout TA
VCC
Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)
- 55 0 0 0
+ 125 1000 500 400
_C ns
tr, tf
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol VIH Parameter Test Conditions
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0
Guaranteed Limit v 85_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
- 55 to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
v 125_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.2 3.7 5.2
Unit V
Minimum High-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V or VCC - 0.1 V |Iout| v 20 mA
V
VOH
Minimum High-Level Output Voltage, QA - QH
Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL
V
|Iout| v 2.4 mA |Iout| v 6.0 mA |Iout| v 7.8 mA
2.48 3.98 5.48
2.34 3.84 5.34
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NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Symbol
tPLH, tPHL
tPLH, tPHL
tPZL, tPZH
tPLZ, tPHZ
VOH
tPHL
fmax
VOL
VOL
ICC
IOZ
Iin
Maximum Propagation Delay, Output Enable to QA - QH (Figures 4 and 8)
Maximum Propagation Delay, Output Enable to QA - QH (Figures 4 and 8)
Maximum Propagation Delay, Latch Clock to QA - QH (Figures 3 and 7)
Maximum Propagation Delay, Reset to SQH (Figures 2 and 7)
Maximum Propagation Delay, Shift Clock to SQH (Figures 1 and 7)
Maximum Clock Frequency (50% Duty Cycle) (Figures 1 and 7)
Maximum Quiescent Supply Current (per Package)
Maximum Three-State Leakage Current, QA - QH
Maximum Input Leakage Current
Maximum Low-Level Output Voltage, SQH
Minimum High-Level Output Voltage, SQH
Maximum Low-Level Output Voltage, QA - QH
Parameter
Parameter
Vin = VCC or GND lout = 0 mA
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND
Vin = VCC or GND
Vin = VIH or VIL
Vin = VIH or VIL IIoutI v 20 mA
Vin = VIH or VIL
Vin = VIH or VIL IIoutI v 20 mA
Vin = VIH or VIL
Vin = VIH or VIL |Iout| v 20 mA
Test Conditions
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|Iout| v 2.4 mA IIoutI v 4.0 mA IIoutIv 5.2 mA |Iout| v 2.4 mA IIoutI v 4.0 mA IIoutIv 5.2 mA |Iout| v 2.4 mA |Iout| v 6.0 mA |Iout| v 7.8 mA
MC74HC595A
4 VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 VCC V 6.0 6.0IIIII 5.0 0.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 - 55 to 25_C - 55 to 25_C 135 90 27 23 150 100 30 26 140 100 28 24 145 100 29 25 140 100 28 24 6.0 15 30 35 0.1 0.26 0.26 0.26 2.98 3.98 5.48 0.26 0.26 0.26 4.0 0.1 0.1 0.1 1.9 4.4 5.9 0.1 0.1 0.1 Guaranteed Limit Guaranteed Limit v 85_C v 85_C 170 110 34 29 190 125 38 33 175 125 35 30 180 125 36 31 175 125 35 30 4.8 10 24 28 1.0 0.33 0.33 0.33 2.34 3.84 5.34 0.33 0.33 0.33 0.1 0.1 0.1 1.9 4.4 5.9 0.1 0.1 0.1 40 v 125_C v 125_C 205 130 41 35 225 150 45 38 210 150 42 36 220 150 44 38 210 150 42 36 4.0 8.0 20 24 1.0 10 160 0.4 0.4 0.4 0.1 0.1 0.1 2.2 3.7 5.2 1.9 4.4 5.9 0.4 0.4 0.4 0.1 0.1 0.1 MHz Unit Unit ns ns ns ns ns mA mA mA V V V
III I I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II II III I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II III I I I I II I II II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I III I II II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I II II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I II I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II III I I I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I
* Used to determine the no-load dynamic power consumption: P D = CPD VCC ON Semiconductor High-Speed CMOS Data Book (DL129/D). NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor High-Speed CMOS Data Book (DL129/D).
IIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I III I I I I II I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II III I II II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II III I I I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Symbol tTLH, tTHL tTLH, tTHL Cout Cin Maximum Three-State Output Capacitance (Output in High-Impedance State), QA - QH Maximum Input Capacitance Maximum Output Transition Time, SQH (Figures 1 and 7) Maximum Output Transition Time, QA - QH (Figures 3 and 7) Parameter
TIMING REQUIREMENTS (Input tr = tf = 6.0 ns)
Symbol
CPD
tr, tf
trec
tsu
tsu
tw
tw
tw
th
Power Dissipation Capacitance (Per Package)*
Maximum Input Rise and Fall Times (Figure 1)
Minimum Pulse Width, Latch Clock (Figure 6)
Minimum Pulse Width, Shift Clock (Figure 1)
Minimum Pulse Width, Reset (Figure 2)
Minimum Recovery Time, Reset Inactive to Shift Clock (Figure 2)
Minimum Hold Time, Shift Clock to Serial Data Input A (Figure 5)
Minimum Setup Time, Shift Clock to Latch Clock (Figure 6)
Minimum Setup Time, Serial Data Input A to Shift Clock (Figure 5)
Parameter
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MC74HC595A
5
2f
VCC V
+ ICC VCC . For load considerations, see Chapter 2 of the
2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0
VCC V
2.0 3.0 4.5 6.0
2.0 3.0 4.5 6.0
--
--
25_C to -55_C
- 55 to 25_C
1000 800 500 400 5.0 5.0 5.0 5.0 50 40 10 9.0 50 40 10 9.0 50 40 10 9.0 50 40 10 9.0 60 45 12 10 75 60 15 13 15 10 75 27 15 13 60 23 12 10
Typical @ 25C, VCC = 5.0 V
Guaranteed Limit
Guaranteed Limit
v 85_C
v 85_C
300
1000 800 500 400 5.0 5.0 5.0 5.0 65 50 13 11 65 50 13 11 75 60 15 13 65 50 13 11 95 70 19 16 65 50 13 11 15 10 95 32 19 16 75 27 15 13
v 125_C
v 125_C
1000 800 500 400 110 80 22 19 110 36 22 19 5.0 5.0 5.0 5.0 75 60 15 13 75 60 15 13 90 70 18 15 75 60 15 13 75 60 15 13 15 10 90 31 18 15
Unit
Unit
pF
pF
pF
ns ns ns ns ns ns ns ns ns ns
MC74HC595A
FUNCTION TABLE
Inputs Serial Input A X D X X Shift Clock X L, H, L, H, Latch Clock L, H, L, H, L, H, Output Enable L L L L Shift Register Contents L D SRA; SRN SRN+1 U U Resulting Function Latch Register Contents U U U SRN LRN Serial Output SQH L SRG SRH U U Parallel Outputs QA - QH U U U SRN
Operation Reset shift register Shift data into shift register Shift register remains unchanged Transfer shift register contents to latch register Latch register remains unchanged Enable parallel outputs Force outputs into high impedance state
Reset L H H H
X X X
X X X
X X X
L, H, X X
L L H = Low-to-High = High-to-Low
* * *
U ** **
* * *
U Enabled Z
SR = shift register contents LR = latch register contents
D = data (L, H) logic level U = remains unchanged
* = depends on Reset and Shift Clock inputs ** = depends on Latch Clock input
PIN DESCRIPTIONS
INPUTS A (Pin 14) Output Enable (Pin 13)
Serial Data Input. The data on this pin is shifted into the 8-bit serial shift register.
CONTROL INPUTS Shift Clock (Pin 11)
Active-low Output Enable. A low on this input allows the data from the latches to be presented at the outputs. A high on this input forces the outputs (QA-QH) into the high-impedance state. The serial output is not affected by this control unit.
OUTPUTS QA - QH (Pins 15, 1, 2, 3, 4, 5, 6, 7)
Shift Register Clock Input. A low- to-high transition on this input causes the data at the Serial Input pin to be shifted into the 8-bit shift register.
Reset (Pin 10)
Noninverted, 3-state, latch outputs.
SQH (Pin 9)
Active-low, Asynchronous, Shift Register Reset Input. A low on this pin resets the shift register portion of this device only. The 8-bit latch is not affected.
Latch Clock (Pin 12)
Noninverted, Serial Data Output. This is the output of the eighth stage of the 8-bit shift register. This output does not have three-state capability.
Storage Latch Clock Input. A low-to-high transition on this input latches the shift register data.
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MC74HC595A
SWITCHING WAVEFORMS
tr SHIFT CLOCK 90% 50% 10% tw 1/fmax tPLH OUTPUT SQH 90% 50% 10% tTLH tTHL tPHL tf VCC GND OUTPUT SQH SHIFT CLOCK RESET tPHL 50% trec 50% VCC GND 50% tw
VCC GND
Figure 1.
VCC GND tPLH 90% QA-QH 50% OUTPUTS 10% tTLH tTHL tPHL OUTPUT ENABLE 50%
Figure 2.
VCC tPZL 50% tPZH OUTPUT Q 50% tPHZ tPLZ 10% 90% GND HIGH IMPEDANCE VOL VOH HIGH IMPEDANCE
LATCH CLOCK
50%
OUTPUT Q
Figure 3.
SHIFT CLOCK
Figure 4.
VCC GND tsu LATCH CLOCK 50% tw VCC GND
VALID SERIAL INPUT A SWITCH CLOCK 50% tsu th 50%
VCC GND VCC GND
50%
Figure 5.
Figure 6.
TEST CIRCUITS
TEST POINT OUTPUT DEVICE UNDER TEST CL* DEVICE UNDER TEST TEST POINT OUTPUT 1 kW CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH.
CL*
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 7.
Figure 8.
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MC74HC595A
EXPANDED LOGIC DIAGRAM
OUTPUT ENABLE LATCH CLOCK SERIAL DATA INPUT A 13
12
14
D SRA R D SRB R D SRC R D SRD R D SRE R D SRF R D SRG R D SRH R
Q
D LRA
Q
15
QA
Q
D LRB
Q
1
QB
Q
D LRC
Q
2
QC
Q
D LRD
Q
3
QD PARALLEL DATA OUTPUTS
Q
D LRE
Q
4
QE
Q
D LRF
Q
5
QF
Q
D LRG
Q
6
QG
SHIFT CLOCK
Q
D LRH
Q
7
11
QH
RESET
10
9
SERIAL DATA OUTPUT SQH
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8
MC74HC595A
TIMING DIAGRAM
SHIFT CLOCK SERIAL DATA INPUT A RESET LATCH CLOCK OUTPUT ENABLE QA QB QC QD QE QF QG QH SERIAL DATA OUTPUT SQH NOTE: implies that the output is in a high-impedance state.
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9
MC74HC595A
PACKAGE DIMENSIONS
PDIP-16 N SUFFIX CASE 648-08 ISSUE T
-A-
16 9
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL.
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
DIM A B C D F G H J K L M S
INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040
MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
SOIC-16 D SUFFIX CASE 751B-05 ISSUE J
-A -
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
K C -T SEATING -
PLANE
R X 45
D 16 PL 0.25 (0.010)
M
M
J
T
B
S
A
S
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10
MC74HC595A
PACKAGE DIMENSIONS
TSSOP-16 DT SUFFIX CASE 948F-01 ISSUE A
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
16
2X
L/2
J1 B -U-
L
PIN 1 IDENT. 1 8
J
N 0.15 (0.006) T U
S
0.25 (0.010) M
A -V- N F DETAIL E
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
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11
CCC EE CCC EE
9
SECTION N-N
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
-W-
DIM A B C D F G H J J1 K K1 L M
MC74HC595A
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
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12
MC74HC595A/D


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